芯片封装焊球连接疲劳寿命预测分析——能量法和有效应变法之比较

Life Prediction for Solder Joint Interconnect in the Package—Strain Energy Density Methodology and Effective Strain Methodology

研究了目前常用的两种芯片封装焊球连接的寿命预测方法-能量法和有效应变法。对焊球连接的材料本构关系进行了对比分析,并利用FORTRAN语言编制了相应的材料本构模型子程序,将其与有限元仿真工具ANSYS耦合,实现了将焊球连接的材料本构模型用户子程序导入到ANSYS的材料库。在此基础上模拟了三维芯片叠层球栅阵列尺寸封装的焊球结构,在热循环条件下(-40～+125℃的工作状态,并分别利用能量法和有效应变法对焊球连接的寿命预测进行了比较分析,最后对两种方法作出了评价。

Two popular life prediction methodologies-strain energy density methodology and effective strain methodology, are investigated. The corresponding solder alloy material constitutive models are compared, and the correlative subroutines about the above material constitutive model are written in FORTRAN and introduced into ANSYS finite element simulation software. 3D die stacked chip scale ball grid array package model is established and simulated under accelerated temperature cycling conditions (-40-+ 125°C), and the solder joint interconnect fatigue life is predicted comparatively.