环糊精包合物研究进展

Advances in studies of cyclodextrin inclusion complex

环糊精作为一种重要辅料,已广泛用于医药、食品、化装品、色谱分析等多个领域。综述了近年来包合物研究的新成果,介绍了环糊精包合物制备的影响因素,新的制备方法,包合比、热力学参数、稳定常数的测定,包合物空间构型的研究以及目前已上市的包合物产品等。

The recent progress in studies of cyclodextrin inclusion complex including factors affecting its preparation, new preparation method, complex ratio determination, thermodynamic parameters, apparent stability constant, stereo-conformation and products marketed were reviewed in this paper.