半导体薄膜特性实时检测的新装置

A New Device on Real-Time Measuring Thin Film Properties

利用光学和电子学结合的方法,建立了基于多光束光学传感器和光电检测电路的检测薄膜特性装置。通过对反射光光点间距变化和光强振荡的检测,实时检测薄膜应力、厚度、生长率等常数的信息。通过理论分析,该装置厚度测量的精度优于2nm,应力的灵敏度优于5MPa,可以应用于半导体集成电路生产线的薄膜生长过程控制检测。

With a new combining method of optics and electronics, a device based on a multi-beam optical sensor and a photoelectric sensing circuit was setup. The thin film stress, thickness and growth rate can be extracted in real-time by measuring the relative variation of the space of the reflected light spots and their intensity oscillations. Through theoretic analysis, the measuring precision of thickness can be 2nm and stress sensitivity 5MPa, and the device can be used in the control and measurement of the thin film growth in IC production line.