摘要
介绍了NiPdAuPPF框架的镀层结构以及键合机理。并针对QFN(QuadFlatNon-lead)封装类型,研究了基于PPF框架的键合工艺优化,着重探讨了为增强第二焊点焊接强度所进行的工艺参数改进。
In this paper, structure of plating layers and mechanism of bonding are introduced. And the optimization of wire bonding process based on PPF Leadframe to QFN package is researched. Improvement of process for increasing second bond strength is emphatically discussed.
出处
《电子工业专用设备》
2005年第5期41-44,共4页
Equipment for Electronic Products Manufacturing
