应用于暂时粘结、基片保护和MOEMS封装的新型材料

The Introduction of Novel Materials That Enable Temporary Bonding, Front-side Etch Protection, and MOEMS Packaging

随着微电子制造商持续缩小晶体管基极和其他元件的尺寸,集成电路的密度不断增大,电路连接工艺中开始使用低k介电质和铜导电体。为了进一步提高电路整体性能与射电频率性能、缩小体积、降低电源损耗、提高散热效率,承载电路的基片的厚度正在持续变薄。常规的工艺已经无法加工先进的超薄基片。为了解决这个工艺中的难题,BrewerScience利用自己先进的材料、工艺、机械设备的研究开发水平,正在开发一套崭新的超薄基片的加工操作流程。介绍用于将超薄基片暂时粘结到另一载体的系列材料和流程,完成加工以后,基片和载体可以很容易地分离。另外,对用于保护基片的新型涂料也进行了介绍。在对基片进行薄化和切割的时候,这种涂料可以对基片提供有效的保护。最后,介绍了高透明高折射材料,这些材料用在高亮度发光二极管(HB-LED)和微光电机械系统(MOEMS)中,可以降低由封装引起的光损耗。

As device manufacturers continue the push to minimize the gate length or minimum CD on the front end of a device, the density of transistors for advanced logic applications has led to more complex metal interconnects with low-k dielectric and copper metallization. Further, the demand for higher functionality, smaller footprint, better RF performance, and better power consumption has also led to thinner and thinner substrates. As a result, conventional wafer handling is not possible. To overcome these problems and enable further processing, Brewer Science is developing novel approaches that combine expertise in material development, process optimization, and equipment customization. This paper introduces a range of products and processes that provide solutions for temporarily bonding a device wafer to a carrier wafer and subsequent easy de-bonding. In addition, sacrificial front-side protective coatings are also introduced for a number of different applications during thinning and dicing. Finally, with the introduction of high-brightness light-emitting diodes (HB-LEDs) and microoptoelectromechanical systems (MOEMS), Brewer Science is developing highly transparent functionalizing materials that minimize coupling loss prior to or during packaging.