摘要
对集成线路板的分布热源产生的三维热传导模型，采用有限差分数值法求解，给出了温度分布及其受基板导热系数、局部热源尺寸和排列影响的计算结果。
The exact three di me nsional temperatu re distribution and thermal analysiS to inte-grated circuit substrates have been presen ted by means of numerical method of a fin ite difference.Thismethed.which will overcome the di fficuItv of mathematical deduction mav be consltieredas an analytical way aided by com puters for thermal design of electron ic compon ents.
出处
《重庆大学学报（自然科学版）》
CAS
CSCD
1994年第6期19-23,共5页
Journal of Chongqing University
关键词
温度场
电子元件
集成线路板
热分析
numerical analysis
local heat source
temperatme distribution
thermal design
