摘要
光刻胶技术是曝光技术中重要的组成部分,高性能的曝光工具需要有与之相配套的高性能的光刻胶才能真正获得高分辨率的加工能力。主要围绕光刻胶在集成电路制造中的应用,对其反应机理及应用性能指标进行阐述,重点从工艺的角度去提出新的研究方向。
Photoresist technology is the important constitute of exposure technology, high performance resolution can be attained by using high performance exposure tools with matched high performance photoresist .The Paper mainly found on the application of photoresist in the process of IC fabrication to summarize the facets of reaction mechanism ,performance index parameters and finally to indicate some new development directions in terms with process evolution target.
出处
《半导体技术》
CAS
CSCD
北大核心
2005年第6期32-36,共5页
Semiconductor Technology
关键词
光刻胶
应用性能
反应机理
集成电路
光刻
photoresist
application performance
reaction mechanisim
IC
photolithography