摘要
阐述了国内外银粉、电子浆料产品的技术现状和发展趋势。国内的相关产品存在技术落后、产品规模小,研发力量投入不足、技术力量薄弱。国外产品科技含量较高,产品大多达到规模化生产、产品逐渐向高性能、低成本方向发展。不断增长的市场需求及国外公司建厂于中国,对尚在发展中的银粉、电子浆料企业带来前所未有的机遇和挑战。
The present situation and trends of silver powder and electronic paste were described. The relative products possess the following characteristics: backward in technique, small in scale, inadequate investment in research and development, lack qualified technical personnel. Abroad, the scientific and technological level is higher. Most of the scales are large. Trend is toward high-performance and low cost. Now, the market demand is increasing. And the foreign corporations are building their factories in China. Which is bringing the chances and challenges to the growing Chinese enterprises to produce silver powder and electronic paste.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2005年第6期54-56,共3页
Electronic Components And Materials
关键词
电子技术
银粉
银浆
综述
现状
趋势
electronic technology
silver powder
silver paste
review
present situation
trend
