摘要
通过对Sn、Cu混合粉末的机械球磨,利用X射线衍射仪、差热热分析仪和扫描电镜对粉末进行了检测与分析,研究了不同球磨条件对Sn-0.7Cu合金形成的影响。结果表明,电压、球料比及球磨时间对Sn-0.7Cu合金的形成有很大影响。对于Sn-Cu二元系,其机械合金化反应机制是通过机械诱发原子扩散,使原子间发生置换固溶和晶界溶解,而逐渐形成Cu6Sn5等合金相的。
The mixed Sn and Cu powder was milled by mechanical ball milling. The milled powders were analyzed by X-ray diffraction, differential thermal analyzer and scanning electron microscopy. The effect of ball milling conditions on the formation of Sn-0.7Cu alloy was investigated. The results showed that voltage, ball-to-powder mass ratio and milling time affect the formation of Sn-0.7Cu alloy significantly. The mechanism of mechanical alloying Sn-Cu was that the mechanically-induced atom diffusion drives substitutional solid solution and interface dissolution, as a result of which Cu6Sn5 was formed.
出处
《焊接学报》
EI
CAS
CSCD
北大核心
2005年第5期9-12,共4页
Transactions of The China Welding Institution
基金
国家863计划项目(2002AA322040)
北京市自然科学基金资助项目(012003)
北京市教育委员会资助项目(05009012200201)
关键词
机械合金化
Sn-0.7Cu合金
球磨条件
反应机制
Ball milling
Copper
Diffusion
Dissolution
Interfaces (materials)
Mechanical alloying
Mixing
Powders
Solid solutions
