SiO_2添加量对XH-11胶线膨胀系数的影响

Effect of silica addition on linear expansion coefficient of XH-11 structural adhesive

研究了经硅烷偶联剂处理的市售SiO2粉添加量对XH11环氧胶线膨胀系数的影响,结果表明,所添加的SiO2粉填料与胶粘剂的配比达0.75时,在剪切强度与无填料的接头相当情况下,其线膨胀系数降低了约1/3,对于降低接头中的温差热应力有明显的作用。

The linear expansion coefficient of the epoxy adhesive modified with SiO2 powder filler was studied. The results showed that the expansion coefficient of the structural epoxy adhesive XH-11 decreased about 1/3 when the loading fraction of the silane-treated filler reached 0.75(filler/adhesive) when the shear strength still kept its level. The decreasing of the expansion coefficient is useful for eliminating the inner stress caused by temperature difference.