摘要
阐述了大腔体器件的储能焊焊接技术,讨论了焊接基本要素,建立了焊接能量模型。分析了影响气密性的主要因素,通过改进焊接技术和优化工艺参数,解决了大腔体器件的气密性焊接技术问题。目前,大腔体器件(150～200mm周长,对角线≤70mm)气密性焊接的成品率已达到93%。
Stored energy welding technology for large cavity devices is described in detail. Basic elements of welding are discussed and a welding energy model is established. Major factors affecting the hermeticity of the device are analyzed.Problems with hermetical welding for large cavity devices are solved by improving the welding technology and optimizing process parameters. So far, the yield of hermetical welding for large cavity devices (perimeter: 150 ～ 200 mm, diagonal: ≤70 mm) reaches 93%?
出处
《微电子学》
CAS
CSCD
北大核心
2005年第3期263-267,共5页
Microelectronics
关键词
电阻焊
大腔体器件
储能焊
气密性
封装
Resistance welding
Large cavity device
Stored energy welding
Hermeticity
Packaging
