陶瓷电路基板的新型金属化技术

A New Type of Metallization Technology for Ceramic Circuit Substrates

研制成功一种新型的陶瓷电路基板的金属化技术，它兼容了薄膜和厚膜技术的优点，采用ＳＥＭ研究了陶瓷基体的浸蚀特性。测量了金属化导体的附着强度、可焊性、薄层电阻、导热能力及微波损耗，并进行了温循和老化等可靠性试验。测试及应用结果表明，采用该技术可在氧化铝瓷基板上制作附着牢固的铜金属化电路图形，其机、电、热性能优良，可靠性好，为微波和混合集成电路衬底金属化技术开辟了新的工艺途径。

A new type of metallizition technology for ceramic circuit substrates which has advantages of both thick and thin film process has been deve-loped.The etching behavior of ceramic substrates was studied by SEM. The adhersion strength,solderability,sheet resistance,thermal conductivity and loss at microwave frequencies were determined. Furthermore, the temperature cycling and aging and other reliability tests were performed. The results of test and application show that by using this technology copper circuit patterns with strong adhersion can be fabricated onto the alumina ceramic substrates, which has excellent mechanical,electrical and thermal performance and good reliabili-ty,and which opens a new way for metallizition technology for microwave and hvbrid IC substrates.