摘要
探析了阳、阴离子树脂对SiO2溶胶中金属离子交换去除的机理,确定阳-阴-阳三步法对SiO2溶胶进行金属离子去除,而后由有机碱调节pH值至碱性稳定区,从而制得高纯度、高稳定性微电子CMP用SiO2溶胶产品。
The effects of cation and anion resin on ellimination mechanism of metal ions exchange in SiO2 colloid are studied.A three-step method is used to elliminate the metal ions in the SiO2 colloid.The organic alkali is added to adjust the pH to the alkali stablevalue,in this case,the high pure and stable SiO2 colloid solution for the micro-electronic CMP is obtained.
出处
《微纳电子技术》
CAS
2005年第7期340-344,共5页
Micronanoelectronic Technology
基金
天津市自然科学基金科技发展计划项目(043801211)
关键词
化学机械抛光
纳米磨料
SIO2溶胶
离子交换
chemical-mechanical polishing(CMP)
nanometer abrasive
SiO2 colloid solution
ions exchange
