摘要
An optical inspection method of the Ball Grid Array package(BGA) was proposed by using a machine vision system. The developed machine vision system could get main critical factors for BGA quality evaluation, such as the height of solder ball, diameter, pitch and coplanarity. The experiment has proved that this system is available for BGA failure detection.
An optical inspection method of the Ball Grid Array package(BGA) was proposed by using a machine vision system. The developed machine vision system could get main critical factors for BGA quality evaluation, such as the height of solder ball, diameter, pitch and coplanarity. The experiment has proved that this system is available for BGA failure detection.
基金
NationalNaturalScienceFoundationof China(No.50390063,50390064,60304010,50128504)andtheStart-up FoundationfortheYoungTeacherof ShanghaiJiaotongUniversity,China
