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无氰电镀工艺的研究现状及解决问题的途径 被引量:29

Research status of non-cyanide electroplating process and approach solving problems
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摘要 本文回顾了无氰电镀工艺的发展状况。指出了当前电镀生产无氰化过程中存在的问题。介绍了当前国内外主要的无氰电镀工艺———无氰镀锌、无氰镀铜、无氰镀金和无氰镀银等工艺的技术现状,指出了今后的研发重点和解决问题的主要途径。 The development status of non-cyanide electroplating was reviewed. The current problems existing in the non-cyanide electroplating production were presented. Major non-cyanide electroplating including non-cyanide zinc electroplating, non-cyanide copper electroplating, non-cyanide gold electroplating and non-cyanide silver electroplating were introduced. The emphases of development and ways of solving problem were presented.
作者 何建平
出处 《电镀与涂饰》 CAS CSCD 2005年第7期42-45,共4页 Electroplating & Finishing
关键词 无氰电镀 锌酸盐镀锌 碱性镀铜 镀金 镀银 non-cyanide electroplating zincate zinc plating alkaline copper plating gold plating silver plating
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