摘要
在阐述电子设备热分析重要性的同时,介绍Icepak软件的应用范围及技术特点;并利用Icepak软件,对某电子设备进行热分析,在此基础上对该电子设备的热控制进行改进设计,通过数值仿真,获得满足热控制要求的优化设计参数。同时介绍应用Icepak进行电子设备热分析及热设计的具体方法和技术。
The importance of the thermal analysis of electronic system is introduced. The applica- tion area and technology characteristic of Icepak is described. Then, the whole process of thermal analysis of some electronic system with Icepak is shown. During the analysis, the thermal control means of the electronic system are improved. By numerical simulation, the optimum design parameter of fulfilling thermal control requirement can be gained. At the same time, the concrete method and technique of electronic equipment thermal design and analysis using the software of Icepack is introduced.
出处
《计算机辅助工程》
2005年第2期50-52,共3页
Computer Aided Engineering