摘要
红外焦平面需要用互连技术把光敏元阵列与信号读出电路进行互连,利用化学镀的方法,在32×32非致冷红外焦平面阵列的CMOS读出电路上镀直径为6μm,高度为2μm的互连柱。测试结果表明,该技术稳定可靠,是实现接触孔互连的可行方法。
IRFPA need interconnection technique to connect the photosensitive units with the readout circuit. In this paper, electroless nickel is applied to interconnection of 32×32 Uncooled IRFPA CMOS readout circuit. The dimension of interconnection is 6 μmin diameter and 2 μmin height. The test shows that this technique is a stable and reliable method to improve the quality of interconncetion.
出处
《红外技术》
CSCD
北大核心
2005年第4期303-306,共4页
Infrared Technology
基金
自然科学基金资助(批准号:60477040)
关键词
互连
红外焦平面
化学镀镍
锌化
Interconnection
Infrared focal plane arrays
Electroless nickel
Zincation
