摘要
综述了氧化铍瓷的金属化及其封接技术,指出氧化铍瓷和Al2O3瓷在金属化工艺上的差异,论文最后汇集了国内外常用烧结金属粉末法15种配方和工艺参数,以资同行专家参考。
The metallization of the beryllia ceramic and its and its seal with metals are reviewed in this paper. The difference of the beryllia ceramic metallization from alumina one is pointed out. 15 metallizing composition formulas and technologies are listed at the end of the paper.
出处
《真空电子技术》
2005年第4期61-64,共4页
Vacuum Electronics
关键词
氧化铍瓷
陶瓷金属化
物理气相沉积
活化钼-锰法
Beryllia ceramics
Ceramic metallization
Physical vapor deposition
Active Mo-Mn process
