贴片机视觉检测中角度计算的一种高效算法

A Practical and Efficient Algorithm of Angle Calculation in Vision System for Automated Wafer Inspection

视觉检测是半导体器件封装贴片设备的核心技术之一。文中提出了半导体芯片视觉检测中角度检测的一种有效算法。该算法通过提取芯片边缘点的坐标点集和拟合直线参数来计算芯片的角度。文章解释了角度检测的含义,介绍了算法的基本思想和算法步骤,并给出了实验数据。实验结果表明,该算法具有较高的准确度和处理速度,满足了实时处理的要求。

An efficient algorithm of angle calculation in vision-based wafer inspection is presented. By finding collinear points at edge of silicon chips and using straight line fitting method, the angle can be calculated. The definition, the theory and the steps of angle calculation are introduced. Experimental results prove the efficiency of the algorithm.