摘要
在分析微装配特点的基础上,讨论了微装配系统的功能需求和组成。提出了一种新型MEMS器件微装配系统设计方案,描述了系统样机关键技术模块的研制方案。以微型光谱分析仪极板对准为示范目标开展了实验研究,结果表明该系统适用于典型MEMS芯片的微对准和封装研究。
Based on the analyses of micro-assembly tasks, the function needed for micro-assembly system was discussed. A new micro-assembly system was designed, and the key modules were described in detail. The system was used to complete the micro-alignment and felt of micro spectral analysis chips. Experiments show that the system is useful in micro-assembly of typical MEMS chips.
出处
《中国机械工程》
EI
CAS
CSCD
北大核心
2005年第14期1226-1228,1232,共4页
China Mechanical Engineering
基金
国家863高技术研究发展计划资助项目(2002AA404450)
国防基础研究项目(k1401060130)
