摘要
给出了以磷掺杂的多晶硅为振动膜的电容式MEMS传声器的研制过程。从等效电路模型出发,研究了电容式MEMS传声器的振动特性和灵敏度,给出了传声器灵敏度随振动膜张力、膜与背板间的空气隙厚度、背板声孔大小及背板声孔所占面积而变化的解析表达式。结合硼掺杂硅/硅复合背板结构MEMS传声器,提供了参考制作工艺流程。样品测试在1kHz频率处的灵敏度达到-60dB(相对于1V/Pa)。
The development of a capacitive micro-machined silicon condenser microphone with P-doped polysilicon diaphragm was described. Based on the equivalent circuit model of the silicon condenser microphone, its vibration characteristics and sensitivity were investigated. An explicit formula for the condenser microphone sensitivity was presented related to the diaphragm stress, air gap between the diaphragm and the back-plate, size of the acoustic holes and the area ratio occupied by the acoustic holes. Fabrication process for the B-doped Si/Si two-layer back-plate MEMS microphone was also given. The measured sensitivity of the microphone samples at 1 kHz frequency is about -60dB (Ref. 1 V/Pa).
出处
《中国机械工程》
EI
CAS
CSCD
北大核心
2005年第14期1243-1247,共5页
China Mechanical Engineering
基金
国家自然科学基金资助项目(10474114)
