屋脊式微通道热沉中关于热传递和流体问题的仿真分析

Simulation Analysis for the Heat Transfer and Flow Issues in V-shaped Microchannel Heat Sink

采用Fluent软件建立了一个屋脊式微通道的数值模型,选取了10组结构参数进行仿真分析,获得了屋脊式微通道的速度、温度等性能参数的数值仿真结果,得到了一组优化的结构设计参数,仿真结果证明,屋脊式微通道热沉可改善二极管激光器的散热能力。

The paper adopted Fluent software to set up one numerical model of V-shaped microchannel, choosing ten groups of structural parameters to simulate, then some numerical simulation results in parameters such as velocity and temperature and the optimized structural design parameter were obtained. The simulation results have been proved to be that V-shaped microchannel can improve the heat dissipation ability of the diode laser arrays.