磁控溅射制备低应力金属膜的工艺研究

Making Low-stress Metal Thin Films with Magnetron Sputtering

研究了在磁控溅射中溅射气压、溅射电压(溅射功率)与金属Au、Ta薄膜应力的关系,分析了相关的机理,给出了一种用磁控溅射法制备低应力Au、Ta薄膜的方法,就应力的产生因素作了一些探讨。

This paper addressed the relation of deposited metal Au, Ta film stresses and the sputtering parameters, such as gas pressure and power of magnetron system. The interrelated mechanism was also analysed. A method was presented to make low-stress metal films deposited by dc magnetron sputtering. The origin of the stress in the deposited films was also discussed.