摘要
采用气泡最大压力法对Sn-9Zn-XBi焊料进行了表面张力测试,用平衡法测试焊料的润湿性。结果表明:Bi的添加大大降低了Sn-Zn系焊料熔体的表面张力;然而焊料暴露在空气环境下1min后,表面形成ZnO导致其表面张力增大;Bi的增加提高了焊料在铜片上的润湿力,缩短了润湿时间;Sn-9Zn-XBi焊料润湿力仍低于Sn-40Pb,其原因是焊料–铜界面能偏高。
The bubble's largest pressure method was employed to measure the surface tension of melting Sn-9Zn-XBi solder alloys. Wetting balance method was used to evaluate the wetting behavior of these solders on Cu substrate. With addition of Bi, surface tension of Sn-Zn melts obviously can be reduced. ZnO usually forms at the surface of Sn-Zn melts, which results the increase of surface tension of the alloys after exposed them to air for 1 min. With addition of Bi, wetting force on Cu substrate of Sn-Zn serial alloys increases, and wetting time of the alloys decreases. The wetting force of the Sn-9Zn-XBi alloys is obviously lower than that of Sn-40Pb, which distributes to higher interfacial tension between the Sn-Zn alloy and Cu substrate.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2005年第8期49-52,共4页
Electronic Components And Materials
