高速PCB板的电磁兼容设计

Design of EMC for the High Speed Circuit PCB

以某一嵌入式系统核心PCB板设计为例,介绍了电磁兼容的基本概念及一些高速PCB板设计的基本知识,着重分析了无高频器件时高速PCB板设计中存在的电源系统干扰、地线噪声干扰和信号线间的串扰等电磁干扰,并分析了这些电磁干扰产生的主要原因,从PCB总体设计和元器件布局、布线等方面考虑,对可能存在的这些干扰,提出了防止和抑制方法以及一些提高PCB板电磁兼容性的具体措施;在工程实践中证明这些方法和措施有效可靠。

Taking one embedded system as example,this paper introduces the basic conception of electromagnetic compatibility and elementary knowledge of high speed circuit PCB design;it analyzes the EMI such as power system interference,GND noise interference and interference of signal transmission line which exist in designing high speed circuit PCB when there are no high frequency devices;then it analyzes the prime reason of causing those EMI. From view of whole design of PCB,outline,wiring and so on,this paper brings forward the method of how to be shielded from interference and gives the specific measure to improve the EMC of circuit PCB;all these methods prove effective and reliable in practice.