摘要
介绍化学机械抛光技术的重要性,找出影响其性能的关键因素即为研磨料。然后对常用的研磨料种类做概要论述,找出其优缺点。并在前人研究的基础上研制出更具优势的抛光研磨料,详细介绍其特点及使用条件,另对它的使用效果进行了简要说明。
The importance of chemical mechanical polishing( CMP)was introduced. The key factor influencing its property was found,that is, slurry. The class of slurry was summarized. The preponderant slurry was prepared on the base of other researchers. The peculiarity and using condi- tion were recommended. On the other hand, the effect of the slurry was showed briefly.
出处
《半导体技术》
CAS
CSCD
北大核心
2005年第8期25-26,33,共3页
Semiconductor Technology
