TC4/Ni/QAl10-3-1.5扩散连接研究

Diffusion bonding of TC4/Ni/QAl10-3-1.5

采用N i箔做中间层在真空下对TC4和QA l10-3-1.5进行扩散连接,用冷场发射扫描电镜(JEOL JSM 6700F)对焊接接头进行金相和能谱分析,用X射线衍射进行相分析,并进行硬度试验和接头拉伸试验。结果表明,在连接温度870℃,连接压力10MPa,保温时间60 m in规范下,N i做中间层能够实现TC4和QA l10-3-1.5扩散连接,其抗拉强度达到325 MPa。扩散连接界面形成了不同的分层结构,由形成了N iTi相,(N iTi+N i3Ti)相和N i(Cu)固溶体构成的扩散反应层。

TC4 and QAl10-3-1.5 were diffusion-bonded with Ni interlayer. The diffusion-bonded joints were evaluated by scanning electron microscopy(JEOL JSM6700F) and its attaching energy dispersive spectroscopy(EDS). Intermetallic compounds at the interface were detected vie X-ray diffraction(XRD) and microhardness tests and tensile testings were done to evaluate the properties of bond joints. The results indicated that TC4 and QAl10-3-1.5 with Ni interlayer were bonded firmly under the condition of 870℃ temperature,10MPa bond stress and 60min holding time, and the bond strength was up to 325MPa, furthermore, various reaction bands appeared in the diffusion zone,and NiTi phase,((NiTi+ Ni_3Ti))phase and Ni(Cu) solid solution were produced at the interface zone.