CuZnAl合金热循环效应的正电子湮没研究

An Investigation of Thermal Cycling Effects in CuznAl Alloy by Positron Lifetime Measurements

ＣｕＺｎＡｌ形状记忆材料（或记忆合金元件）随着热循环反复相变周数增加，相变温度往低温漂移，相变速率与相变热滞减小而记忆性能无大的变化，正电子寿命谱测量表明这些现象主要与空位聚集形成空位团有密切关系。

Phase transition temperatares of A_s,and M_f are shown to decrease in Cu-Zn-Al shapememory alloys with increasing number of thermal cycles.The phase transition rate and transitionhysteresis are found to be insensative to the thermal cycles, Positrun lifetimes measarements sug-gest that the thermal cycling behaviour in closely related to vacancy agglomeratior1 is the shapememory materials.