硅片Map图信息的提取和利用

Extraction and Utilization of Process Information from Si Wafer Maps

分析了硅片Ｍａｐ图所提供的生产成品率和各类不合格芯片的位置分布信息，讨论了利用硅片之间Ｏｖｅｒｌａｐ法（重叠法）和硅片上Ｗｉｎｄｏｗ法（窗口法）对Ｍａｐ图进行的统计。着重讨论了：按硅片中不合格芯片密度的显著差异划分边缘区及中心区；不合格芯片局部聚集现象的定量表示；随机性强的不合格芯片的统计分布；有关信息由相应Ｃ语言软件自动提取，与Ｍａｐ图计算机测试进行联用，可用于生产监控、影响成品率因素分析和工艺缺陷的深入研究。

he process information is extracted from Si wafer map data by using the“overlap”and“window”methods, which analyses dice yield and distribution of “bad”chips statistically. The center and side area on the wafer determined by“bad”chip density are obtained by statistical judgement. The shape and location of bad chip clustering resulting from systematic errors are also obtained through“window”division. The resulting random space distribution of“bad”chips marks the random defect distribution on the wafer. Softwares using these methods can be easily applied to wafer map testing,making process defect control and yield loss analysis easler.