Pb－Sn（10％）合金镀层形成条件的研究

Formative conditions for Pb-Sn(10%)alloy plating

用电化学方法研究了抗氧剂、光亮剂、整平剂对Ｐｂ－Ｓｎ（１０％）合金镀层形成的影响．评价了镀液温度、ｐＨ及电流密度对Ｐｂ－Ｓｎ（１０％）合金性能的影响，给出了适用于氨基磺酸镀液体系电镀Ｐｂ－Ｓｎ（１０％）合金的抗氧剂、光亮剂及最佳电镀工艺条件．

The influences of antioxidant,brightening agent and levelling agent on the plating of Ph-Sn(10%)alloy have been investigated. The author evaltlated the effect of tempereture, pH of the plating solution and the cerrent density on the deposit performance.The antioxidant,brightening agent and the optimum condition for Pb-Sn(10%)alloy plating in sulfamic acid solution have beed given.