2—壬基咪唑在铜表面形成覆膜的化学结构及其热稳定性

Chemical Structure and Thermal Stability of a FilmFormed on Surface of Copper by 2-Nonylimidazole

通过模型络合物方法及傅利叶转换红外光谱、热失重分析等手段，研究了２－壬基咪唑在过渡金属铜表面形成覆膜的化学结构及其热稳定性；进一步论证并提出了该覆膜结构；探讨了该覆膜耐热性及覆膜受热分解温度与Ｚ－壬基咪唑铜模型络合物第一分解温度的关系．本研究对开发该类特异覆膜具有实用及学术价值．

The film formed on the surface of copper of 2-nonylimidazole was studied with model complex by using the method or FT-IR reflection-adsorption spectroscopy andthermogravimetry.Thermal stability of film and the relation between decomposed temperatUre of film and first decomposed tcmperature of 2-nonylimidazole-copper model complexes were discussed.