摘要
氟碳加压检漏法,灵敏度高,可靠性好,已被列为机电部元器件密封性检测的标准方法。但在用于半导体光电器件时却出现漏孔严重堵塞、光学窗口炸裂、指示液易污染等问题。本文根据长期观察、实践,对上述破坏性现象进行了分析、验证,并在如何避免其发生及妥善处理方面作了有益的探讨。
The Pressurizing fluorocarbon leak test is sensitive,realiable, and was stipulated the ISS standard method for tne hermetic determination of electronic devices Nevertheless,the leak stoping up,the optic window bursting, the indicated liquid polluting will emerge,since this method is used in semicon- ductor optoelcctronic devices.Observed and practised for a long time,the destructing phenomena mentioned above are analyzed,verified,and how to avoid them is also discussed with interest.
出处
《半导体光电》
CAS
CSCD
北大核心
1989年第3期82-88,共7页
Semiconductor Optoelectronics
关键词
光电器件
封装
检漏
OPtic Device Package
Leak Test