抗坏血酸对Cu^（2＋）与TPPS_3配位反应促进机理的研究

A Study on Vitamic C Promoting the Mechanism of the Complexing Reaction Between the Cu￣(2+) and TPPS_3

本文利用可见吸收光谱法和直流极谱法研究了抗坏血酸对Ｃｕ（２＋）的还原性、Ｃｕ（２＋）的还原状态、抗坏血酸浓度及溶液中溶解氧浓度对Ｃｕ２＋与三磺基四苯基卟啉（ＴＰＰＳ３）配位反应的影响。实验证明，在抗坏血酸存在下，Ｃｕ２＋与ＴＰＰＳ３可能的配位反应机制为；抗坏血酸首先将Ｃｕ２＋还原为Ｃｕ２＋，Ｃｕ２＋与ＴＰＰＳ３生成很不稳定的、对溶解氧非常敏感的Ｃｕ（Ⅰ）－ＴＰＰＳ３中间体，此中间体一旦生成立即被溶液中的溶解氧氧化为Ｃｕ２＋（Ⅲ）－ＴＰＰＳ３配合物。

With Visible absorption spetroscopy and direct current polaropam approach, this article studies Cu2+ and TPPS_3 complexing reaction being affected by the vitamin C reaction Cu2+ return to the state,the concentration of the aimrbic acid and dissolving oxygen in the solution. The results obtained indicated that the complexing reaction mechanism between Cu+ and TPPS3 may be:Cu2+ ￣+ Cu (I) TPPS3 Cu(Ⅱ) TPPS3.