摘要
本文介绍了电子封装的各种类型,综述了电子封装技术与封装材料的现状及发展趋势,重点讨论了高热导AIN基片金属化及AIN-W多层共烧工艺。
The types of electronic packaging are introduced and the current state and tendency of packaging technologies an materials are reviewed in this paper.The emphasis,is placed on the metallization of high thermal conductivity AIN ceramics substrates and AIN-W co-fired multilayer substrates.
出处
《半导体情报》
1995年第4期42-61,共20页
Semiconductor Information
关键词
电子封装
ALN陶瓷
金属
表面安装技术
Electronic packaging,AIN ceramics,Metallization,Multilayer co-firing,Surface mount technology