摘要
复合陶瓷材料具有较低的介电常数，可与Ｃｕ、Ａｇ导体共烧得到多层基板。这种基板适合于ＬＳＩ高速、高集成度的要求。本文介绍了复合陶瓷基板材料的特征及降低介电常数的措施。
Ceramic composite materials with low dielectric constant can be cofired with Ag or Cu conductor to form multilayer substrates, which are sui-table for VLSI. The basic properties of ceramic composites are described and the methods of reducing dielectric constant are pointed out.
出处
《半导体情报》
1995年第6期7-13,共7页
Semiconductor Information
关键词
陶瓷
玻璃
介电常数
复合基板
Ceramic,Glass,Dielectric constant,Sintering,Composite substrate,Hybrid circuits
