用快速凝固Sn基活性针料低温连接ZnO陶瓷

JOINING ZnO CERAMIC WITH RAPIDLY SOLIDIFIED TIN-BASED ACTIVE SOLDERS AT LOWER TEMPERATURE IN AIR

在大气中成功地用快速凝固Ｓｎ基活性钎料低温连接ＺｎＯ陶瓷．接头的剪切强度明显高于用普通凝固钎料的，最高达６０ＭＰａ．

In this paper, it has been succeeded to join ZnO ceramic with RS Tin-based active solders at lower temperature in air for the first time. The result of shear strength of joints shows that shear strength of joint was enhanced obviously by using RS Sn-based active solders. The max shear strength of joint with RS Sn-based active solder is 60MPa. Lower brazing temperature is needed for joining ZnO ceramic by using RS Sn-based solders in air. The mechanism of joining ZnO ceramic by using RS Tin-based active solders at lower temperative in air may be that the active element Ti diffuses toward the interface of ZnO, reacts with ZnO and forms Ti2O, TiO, TiO2 etc interface phases, therefore realizes the joining.