摘要
根据静电封接的机理,配制了一种低温玻璃作为封接材料,初步完成了常温下的静电封接实验。
According to the mechanism of anodic bonding, we made a kind of low melting point glass for bonding material, and have preliminarily finished room temperature anodic bonding experiment.
出处
《传感器技术》
CSCD
1995年第4期10-12,共3页
Journal of Transducer Technology