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非晶态化学镀Ni-Sn-P合金镀层变温晶化的研究 被引量:1

Study on Thermal Crystallization of Chemical Plated Amorphous Ni-Sn-P Alloy Coating
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摘要 研究了非晶态Ni-Sn-P合金镀层的变温化过程,由实验得出Ni-Sn-P合金约在350℃开始晶化,450℃左右晶化结束,并测得Ni-Sn-P合金变温晶化激活能为233KJ·moL^(-1)。 Thermal crystallization of the amorphous Ni-Sn-P alloy was studied in this paper. The results show that the amorphous Ni.Sn.P alloy crystallization begins at 350C and completes at about 450C. and its crystallization activation energy is 233K J ?moL-1.
出处 《电镀与精饰》 CAS 1995年第3期8-9,共2页 Plating & Finishing
关键词 非晶态 镀合金 镀层 晶化 电镀 镍锡磷合金 amorphous, Ni-Sn -P, crystallization
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同被引文献28

  • 1葛圣松,邵谦,孙宏飞,唐祥国.高锡化学镀Ni-Sn-P合金工艺[J].功能材料,2004,35(z1):3235-3237. 被引量:5
  • 2林忠华,林琳,杜金辉.化学镀Ni-Sn-P合金镀层的研究与应用[J].电镀与涂饰,2005,24(7):8-12. 被引量:13
  • 3闫洪.三元化学镀镍合金层的性能研究[J].新技术新工艺,1995(6):40-41. 被引量:4
  • 4宋长生,王国荣.化学镀Ni-Sn-P合金的工艺研究(Ⅰ)[J].电镀与精饰,1996,18(4):10-12. 被引量:3
  • 5[2]TACHEV D,GEORGIEVA J,ARMYANOV S.Magnetothermal study of nanocrystalline particle formation in amorphous electroless Ni-P and Ni-Me-P alloys[J].Electrochim Acta,2001,47 (1/2):359-369.
  • 6[3]SCHMITT G,SCHMELING E.Properties of chemically deposited Ni-Sn-P polyalloys[J].Metalloberflache,1993,47 (10):493-496.
  • 7[4]BIELINSKI J,SKUDLARSKA E.Buffer and complex former in the process of external electroless Ni-Mo-P precipitation[J].Oberflache Surf,1985,26 (3):76-82.
  • 8[6]BIELINSKI J,JAWORSKA A.Electroless deposition of Ni-Sn-P alloys from citrate bath[J].Inzynieria Powierzchni,2005,23 (1):36-42.
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  • 10[12]LEE C Y,LIN K L.Wetting kinetics and the interfacial interaction behavior between electroless Ni-Sn-P and molten solder[J].Japanese Journal of Applied Physics,2000,33 (5):2684-2688.

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