摘要
研究了非晶态Ni-Sn-P合金镀层的变温化过程,由实验得出Ni-Sn-P合金约在350℃开始晶化,450℃左右晶化结束,并测得Ni-Sn-P合金变温晶化激活能为233KJ·moL^(-1)。
Thermal crystallization of the amorphous Ni-Sn-P alloy was studied in this paper. The results show that the amorphous Ni.Sn.P alloy crystallization begins at 350C and completes at about 450C. and its crystallization activation energy is 233K J ?moL-1.
出处
《电镀与精饰》
CAS
1995年第3期8-9,共2页
Plating & Finishing