摘要
研究了以柠檬酸和EDTA为络合剂,QB-1为添加剂的电镀光亮Sn-Pb合金工艺。探讨了络合剂含量、[Sn^(2+)]/[Pb^(2+)]、阴极电流密度及温度对镀层中Pb含量的影响。综合考虑合金镀层组成、镀层的光泽度及镀液的稳定性,确定了电镀光亮sn-Pb合金的最佳镀液组成及工艺条件。
Bright Sn-Pb alloy electroplating technology with citric acid and EDTA as the complexing agent, and QB-1 as the additive was studied. Effect of [Sn2+] /[Pb2+] , cathodic current density and operating temperature on Pb content in the alloy coating was discussed. The optimum bath composition and technological conditions for obtaining bright Sn.Pb alloy coating were determined after comprehensive considering the composition and lustre degree of the alloy coating, and the stability of the plating bath.
出处
《电镀与精饰》
CAS
1995年第3期4-7,共4页
Plating & Finishing
关键词
电镀
柠檬酸
铅含量
镀合金
锡铅合金
electroplating, Sn-Pb alloy, citrate-EDTA, lead content
