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电镀塑料亚微观粗化表面参数的分析及应用 被引量:3

The Analysis of Characteristic Parameters of Submicroscopic Etched Surface of Electroplatabla Plastics and Its Application in Polypropylene M odifying
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摘要 运用亚微观分析手段,找出电镀塑料粗化表面与镀层剥离强度及表面光洁度有关的参数,选用具有特定颗粒形状、粒径尺寸和粒径分布的无机填料对聚丙烯共混改性,取得了预期的效果. Characteristic parameters ralated to peeling off strength and smouth finish of plated metallic coating of etched surface of electroplatable plastics were found out by using submicroscopic ana-lytical method. Mixing modifying of polypropylene using selected inorganic filler with specific shape, size and diameter distribution was made. The expected effect was obtained.
作者 姜郁英
出处 《电镀与精饰》 CAS 1995年第5期12-15,20,共5页 Plating & Finishing
关键词 塑料 电镀 粗化表面 表面参数 plastics, electroplating, etched surface, submicroscopic analysis
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同被引文献14

  • 1Hermann-Josef Middeke.塑料电镀Ⅰ——塑料电镀的历史与应用,塑料的种类(英文)[J].电镀与涂饰,2005,24(1):35-39. 被引量:9
  • 2李顺林,第八界全国复合材料论文集,1994年,251页
  • 3海臣(译),聚酰亚胺,1981年,96页
  • 4Tomaiuolo F, Montangero P. Alkaline permanganate treatment in etch-back proceses [J]. Trans IMF,1986, 64: 80-84.
  • 5Schroer D, Nichols R J, Meyer H. Pretreatment of polymer surfaces-the crucial step prior to metal deposition [J]. Electrochimica Acta, 1995, 40: 1487-1494.
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  • 7Sam Siau, Alfons Vervaet, Luc Van Vaeck, et al.Adhesion strength of the epoxy polymer/copper interface for use in microelectronics[J]. Journal of the electrochemical society, 2005, 152(6) : 442-455.
  • 8Kirmann J, Roizard X, Pagetti J, et al. Effects of the alkaline pemananganate etching of epoxy on the peel adhesion of electrolessly plated copper on a fibre-reinforced epoxy composite[J]. Adhesion Sci. Technol. ,1998, 12(4): 383-397.
  • 9Mandich N V, Krulik G A. Substitution of nonhazardous for hazardous process chemicals in the printed circuit industry[J]. Metal Finishing, 1992, 90: 49-51.
  • 10Wang Zenglin, Akihiko Furuya, Keiichirou yasuda,et al. Adhesion improvement of electroless copper to a polyimide film substrate by combining surface microroughening and imide ring cleavage[J]. J. Adhesion Sci. Technol, 2002, 16(8):1027-1040.

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