摘要
本文提出一种测定CuSO4含量的螯合滴定方法。该方法是在酸铜镀液中,加入过量的EDTA络合全部的金属离子,再用硫脲、抗坏血酸和1,10-二氮杂菲选择性地分解Cu-EDTA。该方法有效地消除了镀液中Fe3+、Zn2+、Al3+等杂质金属离子对测定结果的干扰,方法简便,结果准确,已被成功用于镀铜生产中CuSO4的测定。
A simple chelatometric method for determination of Cu2+ is presented. The process is based on initial complexation of Cu2+ Fe3+ Zn2+ Al3+ and other metal ions in solution with excessive amount of EDTA and subsequent decomposition of Cu-EDTA with thiourea, ascorbic acid, O-phenanthroline. The method has been successively used for determination of Cu2+ in copper sulfate plating bath.
出处
《电镀与涂饰》
CAS
CSCD
1995年第1期13-15,共3页
Electroplating & Finishing
关键词
镀铜
螯合滴定
硫酸铜
镀液
电镀
chemical analysis, copper plating, chelatometry, selective, copper sulfate