摘要
在微电子元件的贵金属镀层上,残留的盐分会影响元器件的性能。本文根据美国试验与材料协会标准规范和国家军用标准,介绍直接萃取法测定,并举例测试结果。
Salts remaining on the moble metal deposit plated on micro-electronic devices may give inverse effects to its properties. A direct extlaction method is presented for this tasting according to ASTM Standard and The National Military Standard. Examples showing testing results are given.
出处
《电镀与涂饰》
CAS
CSCD
1995年第2期34-35,共2页
Electroplating & Finishing
关键词
电镀
镀层
残留盐分
盐分
测定
electronic device
electroplating
noble metal
quality control
testing method