摘要
用化学镀方法获得含ＴｉＢ２９～１０ｗｔ％的Ｎｉ－ｉＮＮｉ－Ｐ－ＴｉＢ２复合镀层镀层，沉积速度为１５μｍ／ｈ，讨论了工艺条件对沉积速度和镀层中ＴｉＢ２含量的影响。
An electroless plating process is suggested to obtain Ni-P-TiB2 containing 9～10 Wt % of TiB2 at a deposition rate of 15μm/h. Infiuences of various process parameters on deposition rate and TiB2 content in the compostie are discussed.
出处
《电镀与涂饰》
CAS
CSCD
1995年第4期30-33,共4页
Electroplating & Finishing
关键词
化学镀
镀层
镍磷合金
二硼化钛
镀合金
electroless plating, compeite, nickel-phosphorus alloy, titanium boride
