微带线互连与接地技术的研究

Research on Microstrip Interconnection and Ground Connection

本文介绍了在微带线互连上采用银浆的试验情况。对银浆使用于互连及接地的性能进行了测定，并举出应用事例。结果表明互连性能良好，进一步提高了电路的可靠姓，并为微带基片的大面积优良接地提供简便可行的方法。

Abstract：This paper presents experiment on microstrip interconnection with silver liq-uid．Performance of liquid silver used for microstrip interconnection and ground connection ismeasured，and exampies are given. It was proved the performance is good and circuit reliabil-ty if improved．Simple and feasible method is provided for good ground—connection of largearea of microstrip chip.