精密硅片磨床的故障诊断

Fault Diagnosis for Precision Wafer Grinders

当精密硅片磨床处于空载和模拟工作两种工况时，在磨床多点进行位移、速度、加速度的测试。根据故障诊断的相关函数分析方法，应用ＣＤＭＳ信号处理故障诊断与振动分析系统，从理论和实验两个方面分析，推断出该设备工件台平面轴承为主要故障所在。

The field test of displacements,velocities and accelerations of various testpoints in a certilrinprecision wafer grinder is performed in the condition of loadiess oporation and simulative oporation, Usingthe methed of correlation function analysis for fault diagnoois and wlth the alu of CDMS system,a syntheticanalysis is made on the response of the grinde r in beth time domain and frequency domain. Accurateprediction is achieved about the fault of plane bearing of work piece table of the grinder.