集成电路TEM分析的制样技术

A Specimen Prepartion Technique for TEM Analysis of IC

对集成电路（ＩＣ）芯片特定部位作透射电镜（ＴＥＭ）分析，样品制备是非常关键的一步。为此，许多实验室￣［１－３］发展了各种针对性的制样技术。通过吸取各种制样技术的长处，结合目前一般ＴＥＭ实验室的制样条件，本文介绍一种用于普通ＴＥＭ实验室的ＩＣ芯片具体制样方法──使用玻璃陪片，在光学显微镜监视下，以机械减薄形成“劈”形试样，使被分析目标在“劈”的“刃口”上。最后用低角度离子磨削使被分析目标附近形成理想的电子透明薄区。

Sample preparation is a key factor in TEM analysis of the prespecified region of IC chip. Many laboratories have developed various corresponding specimen preparation techniques. By absorbing the advantages of these techniques, this paper introduces a detailed specimen preparation method for IC, which is based on the present conditions of the common TEM labs. It can be summarized as following:At first,a glass slice was glued on the surface of the IC chip,then under the monitoring of the optical micro-scope,the cross-sectional sample was mechanically thinned to form a ″wedge″,and the object to be analyzed is in the ″blade″of the ″wedge″,finally,the low angle ion-milling was used to form a ideal electron transparent region near the object which will be analyzed.