摘要
本文就高速光电器件微波封装提出了有希望的几种复合传输线(微带+共面线,屏蔽微带+共面线,微带+不对称共面线),采用边界元法计算了它们的特性阻抗,给出了几组有工程价值的计算曲线,并讨论了实验结果.
A few promising composite transmission lines (microstrip + CPW,shielded microstrip +CPW and microstrip+asymmetric CPW)are proposed for the microwave packaging of the high speed optoelectronic devices in the paper. Using boundary element method, the characteristic impedance are calculated for the lines. Several sets of theoretical curves are given for the engineering design.The experimental results are discussed.
出处
《电子学报》
EI
CAS
CSCD
北大核心
1995年第3期82-85,共4页
Acta Electronica Sinica
关键词
微波封装
传输线
特性阻抗
边界元法
Microwave packaging
Transmission line
Characteristic impedance
Boundary element method