摘要
利用RBS和TEM技术分析研究了不同注入剂量、注入方式(单重注入,多重注入)对SIMOX材料各层结构的影响,特别着重研究了Si/SiO_2界面过渡区受注入条件的影响.结果表明,在注入剂量相同的情况下,多重注入不仅能改善顶层单晶、SiO_2绝缘层的质量,而且能显著减小Si/SiO_2界面过渡区宽度。
The effect of implantation dose, implantation methods (Single implantation,Sequential implantation)on characteristics and structures have been described by techniques of RBS and TEM. Especially the transition region of Si/SiO2 interface is emphatically studied. The results show that the sequentical implantation and annealing(compared with single implantation in the same implantation dose)can not only evidently improve the quality of top layer and buried layer of SIMOX,but also evidently reduce the width of Si/SiO2 interface transition region.
出处
《电子学报》
EI
CAS
CSCD
北大核心
1995年第5期74-76,共3页
Acta Electronica Sinica
关键词
氧注入
SOI
单重注入
多重注入
Oxygen implantation
SOI
Single implantation
Sequential implantation