改性BMI树脂印刷电路板后处理工艺研究

STUDY OF POST TREATMENT FOR AN IMPROVED BMI MATRIX PRINTED CIRCUIT BOARD

通过示差扫描量热法（ＤＳＣ）和动态力学性能分析（ＤＭＡ）等方法，对改性ＢＭＩ树脂印刷电路板后处理工艺进行研究，根据ＤＳＣ测试原理导出动力学方程，经计算机处理的结果表明，改性ＢＭＩ树脂在２００Ｃ下后处理５小时得到固化程度达１００％，而ＤＭＡ试验显示树脂基体经２００℃下后处理１０小时才能充分固化。并且可以看出，低温条件下，固化效应与相应温度下损耗峰和固化网络部分链段运动有关。

The post treatment for an improved BMI matrix printed circuit board was studiedby using differential scanning calorimetry(DSC),dynamic mechanical analysis(DMA),etc. Based on the principles of DSC,a kinetic equation was obtained and the results computedshowed that 1 00%degree of cure might be achieved after the improved BMI resin wastreated at 200℃ for 5 hrs。However, DMA temperature spectra revealed that curing couldnot be fully completed until the resin had been treated at 200℃ for 10 hrs.It was also foundthat a relationship existed between the curing degree,the height of the damping peak at lowtemperatures,and,thereby,the motion of the segments of the network molecules.