二元胺扩链含硅双马来酰亚胺齐聚物的合成及其性能研究

SYNTHESIS,CURING BEHAVIOR AND THERMAL STABTTY OFNEW SILICONE CONTAINING BISMALEIMIDE OLIGOMERS

本文以４．４′－二胺基二苯甲烷、４，４′－二胺基二苯醚为扩链剂，与含硅双马来酰亚胺Ⅰ、Ⅱ、Ⅲ进行Ｍａｅｃｈａｌ氢移位加成反应，制备出６种含硅双马来酰亚胺齐聚物，并对其分子结构进行了表征。ＤＴＡ测试数据证实，齐聚物的固化反应温度在１５７～３２５℃之间，固化反应的活性顺序为ｄ＞ｃ＞ｆ＞ｂ＞ｅ＞ａ；齐聚物固化树脂的热分解过程分阶段进行，固化树脂的热稳定性顺序为ｆ＞ｅ＞ｄ＞ｃ＞ｂ＞ａ。研究结果表明，有机硅桥接基团的引入可大幅度提高齐聚物的溶解性；而一Ｏ一桥接基团的引入可降低齐聚物的固化反应温度并提高固化树脂的热稳定性；齐聚物的固化反应活性、热稳定性以及溶解性与其分子结构相对应。

A series of bismaleimide oligomers were synthesized by extending silicone containing bismaleimides with 4 , 4' -(diamino diphenyl)methane and 4 , 4' -(diamino diphenyl) ether, and were characterized by FT-IR. The solubility nseasurment indicated that all the oligomrs showed good solubility even in low boiling point solvent such as acetone and methanol etc. and the DTA traces showed that the loigomere cured in the temperature range of 157￣325℃. The DTA traces of cured resins determinated that all the cured oligoasers showed thermal stable untill 300 ℃. The paper also discussed the retationship of the loigomer molecular structure and their properties.